Development Scope
PCB Design & Hardware Development
| Hardware Development Tasks | Description | Remark |
|---|---|---|
| 4‑Layer PCB Design | Optimized signal routing for low‑noise current measurement | ✔ |
| Low‑Power Component Selection | Use of ultra‑low‑power ICs to extend battery life | ✔ |
| Unique Serial Code Marking | Printed on PCB and/or external sticker for mapping & tracking | ✔ |
| Magnetic Switch Integration | Built‑in reed sensor for power activation & maintenance mode | ✔ |
| LoRa (Mesh) Hardware Support | RF‑optimized layout for stable Mesh communication | ✔ |
| Rugged Enclosure Compatibility | Mechanical + thermal design alignment with enclosure | ✔ |
Firmware Development
| Firmware Development Tasks | Description | Remark |
|---|---|---|
| Embedded Firmware (C/C++) | Low‑power optimized firmware for arc‑time detection | ✔ |
| LoRa (Mesh) Stack Integration | ADR support, AES security, uplink/downlink, duty‑cycle control | ✔ |
| Current Sensor Processing | Filtering algorithms + auto‑calibration for environment variations | ✔ |
| OTA Support | Remote configuration updates over LoRa (Mesh) | ✔ |
| Event‑Driven Architecture | Real‑time arc event detection & packet generation | ✔ |
| Diagnostics & Watchdog | Fault monitoring, self‑check, and watchdog timer handling | ✔ |
Power Management
| Power Management Tasks | Description | Remark |
|---|---|---|
| Deep Sleep Mode | Ultra‑low‑power state with wake‑up via magnetic switch or sensor event | ✔ |
| Battery Life Optimization | System engineered to exceed 5 months of operation under typical usage | ✔ |
| Low‑Quiescent Power Circuit | Efficient power supply design using low‑Iq components | ✔ |